X-Ray
	X-Ray inspection is a non destructive testing method. The X-Ray test allows us to determine simple key structural elements of the component such as: Die presence or Bond wire presence and location. Take a look inside the component with this non-destructive analysis to examine component hardware (dice, wire bonds, leadframe configuration) to verify everything is intact and there are no significant voids. Voids can lead to device fracture as the air pocket expands and contracts when the parts is heated (during use and reflow oven when assembling component to the PCB). Broken wire bonds and cracked dice result in electrical failures, and counterfeit devices can be determined by comparing the hardware structure (skeleton) to a known-good part, they should be identical!