Decapsulation
	Decapping removes thebody of the device through a safely controlled chemical process exposes the actual die structure of the component, including the bond wire in many cases. Although decapsulation is a destructive test, under high powered microscopy, we can normally view critical information on the die, such as the manufacturers name, the manufacturers logo and part number ect.
In extreme situations where the dies has been copied, the same manufacturers die has been copied or parts have been remarked to make them look like upgraded specification parts, we can determine specific areas of the dies that will correspond only with the original die.